PROPERTIES

 - Suitable for industrial applications

 - Outstanding thermal conductivity

 - Silicone-free

 - Electrically non-conductive

 - No hardening over time

 - Available in three sizes: 2g | 6g | 30g

SILICONE-FREE FOR INDUSTRIAL SYSTEMS

Hydronaut Pro thermal paste features a silicone-free carrier structure. In many thermal pastes, silicone-based oils (e.g., siloxanes) are used as the carrier fluid or as a component of the matrix. Under thermal stress, especially during temperature fluctuations, changes in the paste may occur, such as bleeding and displacement of the paste from the contact zone. Repeated temperature fluctuations as well as micro-movements between the CPU IHS and the cooler base can intensify this effect. The mechanical displacement of the paste from the contact surface is referred to as the pump-out effect. In normal PC use, this is generally uncritical. In industrial applications, however, leaking silicone-based oil may be undesirable, particularly if adjacent materials or sealing materials (e.g., certain EPDM or NBR seals) are incompatible with silicone oils. This can lead to swelling or changes in material properties. The product is RoHS compliant and designed as an easy-to-apply thermal interface material for demanding users.

MATCHING ACCESSORIES

For optimal application, the TG Spatula Pro is included with Hydronaut Pro. The spatula's revised design allows for increased pressure during application, ensuring efficient spreading and a thinner layer of thermal paste.

 - 1x Hyronaut Pro
 - 1x Applicator

 - 1x TG Spatula

 - 1x TG Spatula Pro